Thick Film Chip Heating Plate

Thick Film Chip Heating Plate

Compared with Aluminum Cast and Immersion Heating Element, Thick Film Heating Element is higher in power density(60W/cm²), quicker temperature ramp up rate(80℃/S) and better thermal transfer (96%).

Thick Film Heating Circuit printed on the back side of the kettle bottom. Due to it's much thinner, it saves much space and deliver more possibility for new model research and design.

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